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February 2008

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Subject:
From:
Jack Olson <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jack Olson <[log in to unmask]>
Date:
Thu, 7 Feb 2008 17:43:59 -0600
Content-Type:
text/plain
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text/plain (67 lines)
I may owe the group an apology...

For the curious, I'll answer the questions people asked me:
- the product has been in production for a long time with no problems.
- product must operate at 125C, so after ICT we do a "hot" functional test.
- all at once we had massive fallout, ICT okay, hot NOT.
- failures in random locations, unpredictable
- same vendor, all boards from same same date code
- bare-board vendor on chinese holiday, no response yet

We sent a few failed assemblies out to be analyzed, and the
picture I provided in the link below was the first thing we got back,
but with no analysis

Since then we have found cracked via barrels, which seems
to be a more likely culprit. (but I'm no expert)
If I asked for help without waiting for enough supporting info,
I'm sorry.

but I would like to know more about "cross section artifacts"?
Where can I learn about that?
I can't visualize how the cross section could be a normal beginning
or an ending of a trace, but maybe I'm showing my ignorance
willing to learn,
Jack


.
On 2/7/08, [log in to unmask] <[log in to unmask]> wrote:
>
> Beware of cross section artifacts.   If this is not the sites you were
> aiming for it may not be a defects.   Could the beginning of a trace or
> the ending.   I see this often.
>
>
> Victor,
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Jack Olson
> Sent: Thursday, February 07, 2008 9:33 AM
> To: [log in to unmask]
> Subject: [TN] FAB: Thin Trace Failures
>
> Has anyone ever seen a cross-section like this?
>
> http://www.frontdoor.biz/PCBportal/opentrace.jpg
>
> (ignore the words on the pic, just a guess)
>
> Can you point me in the right direction for cause?
>
> thanks,
> Jack
>
>
>

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