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Subject:	Re: SAC on gold pins
From:	Joyce Koo <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Joyce Koo <[log in to unmask]>
Date:	Thu, 7 Feb 2008 16:28:45 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (105 lines)

Based on my recollection, the requirement for gold and Sn/Pb connectors'
mating force are different.  Not sure about the SAC.
                   jk

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Wenger, George M.
Sent: February 6, 2008 4:51 PM
To: [log in to unmask]
Subject: Re: [TN] SAC on gold pins

The only way to know for sure is to run a reliability eva
Genny,

The only way to know for sure is to run a reliability evaluation.
However,  I think the time would be better spent determining why solder
wets into the connector mating area.  If you're finding SAC solder
wetting that much to get into the contact area what was happening when
you used non-SAC SnPb solder.  My first guess is that you should reduce
the amount of SAC solder printed on the header pads to solder flow so
that it doesn't get into the contact area.

Regards,
George
George M. Wenger
CommScope / Andrew Wireless Solutions
Senior Principal FMA / Reliability Engineer
40 Technology Drive, Warren, NJ 07059
(908) 546-4531 [Office]  (732) 309-8964 [Cell]

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Genny Gibbard
Sent: Wednesday, February 06, 2008 3:43 PM
To: [log in to unmask]
Subject: [TN] SAC on gold pins

So,...
During assembly, say that you see SAC solder wicking up the pins of a
finepitch surface mount header onto the contact area which is
gold-plated.  The gold-plated header normally mates with gold socket
connector.  
What would be the reliability issues with SAC solder in contact with the
gold socket?  Does the silver in the solder mitigate any of the
tin-to-gold issues I have been reading about?

Genny

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