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February 2008

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Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Thu, 7 Feb 2008 09:00:03 -0600
Content-Type:
text/plain
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text/plain (52 lines)
LOL! 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Igoshev, Vladimir
Sent: Thursday, February 07, 2008 8:45 AM
To: [log in to unmask]
Subject: Re: [TN] SAC on gold pins

Hi Werner,

I was expecting your replay with respect to "Ag embrittlement":-).
However, with the exception of your verbal referrences to an old and
confidential report, I haven't seen any published data provingv the
point. 

I always look forward to learn something new, though :-).

Regards,

Vladimir

----- Original Message -----
From: [log in to unmask] <[log in to unmask]>
To: Igoshev, Vladimir; [log in to unmask] <[log in to unmask]>
Sent: Thu Feb 07 09:12:06 2008
Subject: Re: [TN] SAC on gold pins

Hi Vladimir,
I did not think Genny's question related to solder joints.
However, your point about Au-embrittlement needs to be corrected.
Ag-embrittlement is as bad as au-embrittlement, and for the very same
reasons. And the effect of the two in combiation is additive.

Werner



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