TECHNET Archives

February 2008

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Paul Edwards <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Paul Edwards <[log in to unmask]>
Date:
Wed, 6 Feb 2008 14:14:33 -0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (55 lines)
Genny,

The Sn is the problem... With the high percentage of Sn in SAC the probabilities are that the bulk of the surface contact area will be Sn, which as you know will oxidize and form a non-conductive surface interface.... This will happen before you have to worry about the Sn-Au intermetallic interface failure.....

Paul

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Genny Gibbard
Sent: Wednesday, February 06, 2008 12:43 PM
To: [log in to unmask]
Subject: [TN] SAC on gold pins

So,...
During assembly, say that you see SAC solder wicking up the pins of a
finepitch surface mount header onto the contact area which is
gold-plated.  The gold-plated header normally mates with gold socket
connector.
What would be the reliability issues with SAC solder in contact with the
gold socket?  Does the silver in the solder mitigate any of the
tin-to-gold issues I have been reading about?

Genny

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

==============================================================================

This email and any attachments thereto may contain private, confidential, and
privileged material for the sole use of the intended recipient. Any review, copying,
or distribution of this email (or any attachments thereto) by others is strictly prohibited.
If you are not the intended recipient, please contact [log in to unmask]
immediately and permanently delete the original and any copies of this email and
any attachments thereto. 

==============================================================================


---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2