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February 2008

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Subject:
From:
Genny Gibbard <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Genny Gibbard <[log in to unmask]>
Date:
Wed, 6 Feb 2008 16:02:21 -0600
Content-Type:
text/plain
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text/plain (104 lines)
Yes, you are absolutely right, and that excess solder issue is being
addressed.  We know this is a process issue -  we were having unrelated
problems with this connector, and someone started experimenting with the
process and created new problems not previously evident.  One of those
experiments resulted in solder wicking way up the pins into the contact
area.

Reworking these connectors is going to be a trial, and I was wondering
whether it was just a process indicator that we could say 'let them go,
and we will correct the process for the future', or an actual
reliability / defect issue that should be corrected before boards ship.

I am thinking the latter.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Wenger, George M.
Sent: February 6, 2008 3:51 PM
To: [log in to unmask]
Subject: Re: [TN] SAC on gold pins

The only way to know for sure is to run a reliability evaluation.
However,  I think the time would be better spent determining why solder
wets into the connector mating area.  If you're finding SAC solder
wetting that much to get into the contact area what was happening when
you used non-SAC SnPb solder.  My first guess is that you should reduce
the amount of SAC solder printed on the header pads to solder flow so
that it doesn't get into the contact area.

Regards,
George
George M. Wenger
CommScope / Andrew Wireless Solutions
Senior Principal FMA / Reliability Engineer 40 Technology Drive, Warren,
NJ 07059
(908) 546-4531 [Office]  (732) 309-8964 [Cell]

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Genny Gibbard
Sent: Wednesday, February 06, 2008 3:43 PM
To: [log in to unmask]
Subject: [TN] SAC on gold pins

So,...
During assembly, say that you see SAC solder wicking up the pins of a
finepitch surface mount header onto the contact area which is
gold-plated.  The gold-plated header normally mates with gold socket
connector.  
What would be the reliability issues with SAC solder in contact with the
gold socket?  Does the silver in the solder mitigate any of the
tin-to-gold issues I have been reading about?

Genny

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