The only way to know for sure is to run a reliability eva
Genny,



The only way to know for sure is to run a reliability evaluation.

However,  I think the time would be better spent determining why solder

wets into the connector mating area.  If you're finding SAC solder

wetting that much to get into the contact area what was happening when

you used non-SAC SnPb solder.  My first guess is that you should reduce

the amount of SAC solder printed on the header pads to solder flow so

that it doesn't get into the contact area.



Regards,

George

George M. Wenger

CommScope / Andrew Wireless Solutions

Senior Principal FMA / Reliability Engineer

40 Technology Drive, Warren, NJ 07059

(908) 546-4531 [Office]  (732) 309-8964 [Cell]



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Genny Gibbard

Sent: Wednesday, February 06, 2008 3:43 PM

To: [log in to unmask]

Subject: [TN] SAC on gold pins



So,...

During assembly, say that you see SAC solder wicking up the pins of a

finepitch surface mount header onto the contact area which is

gold-plated.  The gold-plated header normally mates with gold socket

connector.  

What would be the reliability issues with SAC solder in contact with the

gold socket?  Does the silver in the solder mitigate any of the

tin-to-gold issues I have been reading about?



Genny



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