Kerfuffle?  I like it.

Dewey, lets add that to the IPC T-50 document.

Doug Pauls




Craig Cullum <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
02/29/2008 09:35 AM
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Re: [TN] Gold Plating Question






I just wanted to let everyone who participated in this thread that I
very
much appreciated learning something new. We recently experienced this
for
the first time (that I ever recall) and it caused a small kerfuffle and
some embarrassement on my part.

Thank you (from one lurker) !

Craig Cullum, Engineering Technologist, AMTELCO
e: [log in to unmask]
   [log in to unmask]
f: 608 838 8367
v: 608 838 4194, or 4197, x128

Please visit us at www.amtelco.com 

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Paul Greene
> Sent: Wednesday, February 27, 2008 3:07 PM
> To: [log in to unmask]
> Subject: Re: [TN] Gold Plating Question
> 
<SNIP>
> Depending on the chamfer, the design itself may result in a 
> piece of the buss bars being left. In either case, exposed 
> copper will be seen and is acceptable per IPC-A-600.
> Paul Greene

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