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February 2008

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Subject:
From:
Kathy Kuhlow <[log in to unmask]>
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Date:
Thu, 28 Feb 2008 10:41:47 -0600
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Werner, 

Thanks, I will forward your response off.

Kat

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /*
Sent: Thursday, February 28, 2008 10:16 AM
To: [log in to unmask]
Subject: Re: [TN] Lead free questions

Hi 'K,'
There is no real down-side to the use of the 'lead-free process' for leaded 
products. You will get somewhat thicker IMC layers, but that has no solder 
joint reliability consequences (excepting component and PCB issues), unless
you 
have a large number of excursions to the soldering temperature.
As you say "We are excluded for reasons....," but than on the other hand so 
should everybody else as well.

Werner



**************
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