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February 2008

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Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Joyce Koo <[log in to unmask]>
Date:
Thu, 28 Feb 2008 11:41:26 -0500
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Fatigue, thermal shock, service life, etc..jk 
--------------------------
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----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Thu Feb 28 11:15:38 2008
Subject: Re: [TN] Lead free questions

Hi 'K,'
There is no real down-side to the use of the 'lead-free process' for leaded 
products. You will get somewhat thicker IMC layers, but that has no solder 
joint reliability consequences (excepting component and PCB issues), unless you 
have a large number of excursions to the soldering temperature.
As you say "We are excluded for reasons....," but than on the other hand so 
should everybody else as well.

Werner



**************
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