Do a Google search for "Optimization of Solder Paste Printability with Laser
Inspection" (include the "") and you get this:
OPtimization of Solder Paste Printability with Laser Inspection ...P T A B L
I T. TEEC HNIQUE. T.Okura MI.Kanai S.Qgata T.'Takei H.Tiik&usagi. PGB
Engineering Dept., Computer and Network Systems Group ...
ieeexplore.ieee.org/iel5/4023/11545/00526187.pdf - Similar pages
OPtimization of Solder Paste Printability with Laser Inspection ...Page 1.
Page 2. Page 3. Page 4. Page 5.
ieeexplore.ieee.org/iel3/4023/11545/00526187.pdf?arnumber=526187 - Similar
pages
More results from ieeexplore.ieee.org »
System and methods for data-driven control of manufacturing ...Okura, et
al., “Optimization of Solder Paste Printability with Laser Inspection
Technique,” 1995 IEEE, PCB Engineering Dept., Computer and Network Systems
...
www.patentstorm.us/patents/7171897.html - 46k - Cached - Similar pages
System and methods for data-driven control of manufacturing processes -
Google Books Result-
Okura, et al., "Optimization of Solder Paste Printability with Laser
Inspection Technique," 1995 IEEE, PCB Engineering Dept., Computer and
Network Systems ...
books.google.com/books?id=8NJ-AAAAEBAJ...
Hope it is helpful.
One of your IEEE friends should be able to get it.
I am not old enough (ha, ha, ha.)
Ahne.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
Sent: Tuesday, 26 February, 2008 08:43
To: [log in to unmask]
Subject: [TN] reference
Does any of old chaps still got this? Thanks.
jk
Optimization of solder paste printability with laser inspectiontechnique
Okura, T.; Kanai, M.; Ogata, S.; Takei, T.; Takakusagi, H.
Electronics Manufacturing Technology Symposium, 1995. apos;Manufacturing
Technologies - Present and Futureapos;, Seventeenth IEEE/CPMT International
Volume , Issue , 2-4 Oct 1995 Page(s):361 - 365 Digital Object Identifier
10.1109/IEMT.1995.526187 Summary:This paper describes an evaluation
technique for solder paste printability using a solder paste inspection
system and optimization of printing parameters. In a Surface Mount Assembly
(SMA), it is very important to evaluate printability of solder paste
precisely, because printability of solder paste directly influences reflow
soldering quality. We established quite reliable inspection criteria for
print quantity of solder paste. So it was found that about 90% of reflow
soldering defects could be reduced by prevention of printing defects.
Furthermore, since package types have been varied in a SMA, high soldering
quality demands stable printability for all patterns. This paper presents a
printability evaluation adopted procedure based on the quality engineering
(TAGUCHI method). As a result of optimizing squeegee shape and printer
condition by this evaluation method, printability was improved better than
20% in the production process. And optimization of solder paste and stencil
added to printer condition resulted in good printability for 0.3 mm pitch
patterns on the optimum condition
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