Subject: | |
From: | |
Reply To: | |
Date: | Tue, 26 Feb 2008 15:17:11 -0500 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Dear Technetters,
Where would I be able to find guidance on the suitability of a particular component for second side reflow?. Obviously, the weight of the component on the bottom side has to be <= by the solder surface tension force to prevent the component from falling off the board during reflow. Is there literature available for calculation of the maximum wt of a component that can be safely put on a pad, knowing the pad geometry, solder volume and lead surface area?
Sounds simple enough....until you go to do the actual calculation.
Any pointers would be greatly appreciated.
Thanks,
Amol
WARNING: Export Control
This document may contain technical data within the definition of the
International Traffic in Arms Regulations (ITAR), and subject to the Export
Control Laws of the U.S. Government. Transfer of such data by any means to a
foreign person, whether in the United States or abroad, without proper export
authorization or other approval from the U.S. Department of State is
prohibited.
CONFIDENTIALITY NOTICE:
This e-mail, and any attachments, is for the sole use of the intended
recipient(s) and may contain information that is confidential and
protected from disclosure under the law. Any unauthorized review, use,
disclosure, or distribution is prohibited. If you are not the intended
recipient, please contact the sender by reply e-mail, and delete/destroy
all copies of the original message and attachments.
Thank you.
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|