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February 2008

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Subject:
From:
"Douglas O. Pauls" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 6 Feb 2008 08:12:03 -0600
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Thank you everyone for your responses to my question.  I believe I have 
what I need.

I should have been more specific in my request in that I was not looking 
for gap filling materials like Sil-Pad or the Berquist material, but more 
of a blanket material going over the top of components.  Think Shrink Wrap 
over the top.

Doug Pauls




Olav Folland <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
02/05/2008 06:20 PM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Olav Folland <[log in to unmask]>


To
[log in to unmask]
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Subject
Re: [TN] Molded silicone thermal sheets






Doug,

If you don't have too much variation in component height, try 
Bergquist's Gap pad materials.  They're available in sheet form and are 
pretty flexible.  They also have several different hardnesses to pick 
from depending on your needs.  We've used it with good success between 
PCBs and chassis for heatsinking devices.

Olav Folland
Galil Motion Control

Douglas O. Pauls wrote:
> OK, so it is late afternoon, I have sniffed too much toluene for one day 

> and the brain is not functioning like it should (leave it alone Dewey).
>
> I know in the past few months reading something about companies that 
will 
> make molded silicone overlays that go on top of electronic assemblies. 
The 
> silicone can be loaded with thermal conductive fillers, such that you 
have 
> a flexible heat sink that can be applied over a board surface.
>
> Do any of you know the company that produces such a beast?
>
> Doug Pauls
> Rockwell Collins
>
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