Victor,

I was not stating that it was the actual problem but that it could be.  The 
image you attached is a cross-section that did not fail.  In some cases the 
gold removal process succeeds on most of the board hence only a few regions 
will exhibit the problem.  

The resulting failure is not easy to see.  If you seem to see intermetallic with a 
layer of nickel attached seperating from the PCB that still has a nickel layer 
that is an indication.  I'm not sure that the failed image clearly had that but it 
was stated as different than the others.

The gold is almost invisible even at 800X magnification.   

Without the sample on a microscope to view it is very hard to make a 
determination.  SEM analysis is even better to make determinations.

What I said I did not regard as an absolute fact in this case.  It is just a 
possiblity.

Drew

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