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| Date: | Mon, 25 Feb 2008 15:21:09 -0500 |
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That is a different ball game all together, then :-) Thank you for
saving my sanity :-)
Vladimir
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Drew meyer
Sent: Monday, February 25, 2008 3:03 PM
To: [log in to unmask]
Subject: Re: [TN] Metallurgists, need assistance, closing this one
Vladimir,
Not wrong in context. I did not state one important fact. After
attempting to
remove the gold the PCB manufacturer lays down another layer of nickel.
Thus reflow consumes the second gold layer into the solder joint.
On an inffectively stripped PCB, after reflow, you have the following.
From the pad up to the solder joint.
copper, nickel, gold, nickel, intermetallic, solder
The gold interface between the nickel layers is very weak and yields at
very
low levels of stress.
Drew
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