Yepper. Thanks, Joe and Dave.
Bev
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joe Fjelstad
Sent: Monday, February 25, 2008 11:28 AM
To: [log in to unmask]
Subject: Re: [TN] Need a literature reference
Hi Bev,
Based on Dave's input, this might be what you are looking for. They
speak of
a lolly pop pad for checking wetting, which could possible be
considered by
analogy as a thermometer.
Best,
Joe
United States Patent 5,827,951
Yost , et al. October 27, 1998
Solderability test system
Abstract
A new test method to quantify capillary flow solderability on a printed
wiring board surface finish. The test is based on solder flow from a
pad onto
narrow strips or lines. A test procedure and video image analysis
technique were
developed for conducting the test and evaluating the data. Feasibility
tests
revealed that the wetted distance was sensitive to the ratio of pad
radius
to line width (l/r), solder volume, and flux predry time.
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