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February 2008

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Subject:
From:
Joe Fjelstad <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Mon, 25 Feb 2008 11:27:36 EST
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text/plain
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Hi Bev, 
 
Based on Dave's input, this might be what  you are looking for. They speak of 
a lolly pop pad for checking wetting,  which could possible be considered by 
analogy as a  thermometer.
 
Best, 
Joe   
 
 
United  States  Patent 5,827,951 
Yost ,   et al.   October 27, 1998  
Solderability test system   
Abstract 
A new test method to quantify capillary flow  solderability on a printed 
wiring board surface finish. The test is based  on solder flow from a pad onto 
narrow strips or lines. A test procedure  and video image analysis technique were 
developed for conducting the test  and evaluating the data. Feasibility tests 
revealed that the wetted  distance was sensitive to the ratio of pad radius 
to line width (l/r),  solder volume, and flux predry time.  




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