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February 2008

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Subject:
From:
Olav Folland <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Olav Folland <[log in to unmask]>
Date:
Tue, 5 Feb 2008 16:20:35 -0800
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Doug,

If you don't have too much variation in component height, try 
Bergquist's Gap pad materials.  They're available in sheet form and are 
pretty flexible.  They also have several different hardnesses to pick 
from depending on your needs.  We've used it with good success between 
PCBs and chassis for heatsinking devices.

Olav Folland
Galil Motion Control

Douglas O. Pauls wrote:
> OK, so it is late afternoon, I have sniffed too much toluene for one day 
> and the brain is not functioning like it should (leave it alone Dewey).
>
> I know in the past few months reading something about companies that will 
> make molded silicone overlays that go on top of electronic assemblies. The 
> silicone can be loaded with thermal conductive fillers, such that you have 
> a flexible heat sink that can be applied over a board surface.
>
> Do any of you know the company that produces such a beast?
>
> Doug Pauls
> Rockwell Collins
>
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