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February 2008

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Subject:
From:
"David D. Hillman" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Fri, 22 Feb 2008 16:50:10 -0600
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Hi Werner! Ok, so you don't want to read the whole web site! : - ) 

Here is a more specific link:

http://acqp2.nasa.gov/LFS%20Reliability/Rockwell%20Collins%20Inc%20JCAA%20JGPP%20Final%20Report%20neg55C%20to%20pos125C%20testing%20Rev%20B.pdf

The shrinkage void data is in the Thermal Cycle individual report (see 
figure 45, page 33) on shrinkage voids. We ran thermal cycle testing -55C 
to +125C for 4700+ cycles per IPC-9701 and did not find an occurrence were 
a shrinkage void caused a failure or acted as a stress riser.

Dave



[log in to unmask] 
02/22/2008 04:37 PM

To
[log in to unmask], [log in to unmask]
cc

Subject
Re: [TN] Shrink hole voids






Hi Dave & All,
http://acqp2.nasa.gov/LFS%20Reliability/JTR%20Executive%20Summary%20Draft%20July-14-2006.pdf
JCAA/JG-PP Lead-Free solder Project, Joint Test Report, Draft July 14, 
2006 only makes a one-sentance statement that "Solder Joint Shrinkage 
Voids and Fillet Lifting: No thermal cycle failures were observed due to 
the presence of solder joint shrinkage voids or fillet lifting phenomena."
I certainly would not draw any conclusions from this.
Coyle's paper deals with gaseous voids, not shrinkage voids.




Werner



**************
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(
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)

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