Hi Dave & All,
> 
> http://acqp2.nasa.gov/LFS%20Reliability/JTR%20Executive%20Summary%20Draft%20July-14-2006.pdf
> JCAA/JG-PP Lead-Free solder Project, Joint Test Report, Draft July 14, 2006 
only makes a one-sentance statement that "Solder Joint Shrinkage Voids and 
Fillet Lifting: No thermal cycle failures were observed due to the presence of 
solder joint shrinkage voids or fillet lifting phenomena."
> I certainly would not draw any conclusions from this.
> Coyle's paper deals with gaseous voids, not shrinkage voids.
> 
> 
> 
> 
> Werner
> 


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