Hi gang! Too much Diet Coke and its a Friday. My previous reference was
for the impact of voids on solder joints. Here is another reference
specifically for discussing the impact of shrinkage voids on solder joints
(again, no impact other than the physical reduction of crack path
necessary to cause an open).
JCAA/JGPP Consortia, Preliminary Joint Test Report (JTR), ?JCAA/JGPP
Lead-free Solder Project?,
http://acqp2.nasa.gov/LFS%20Reliability/JTR%20Executive%20Summary%20Draft%20July-14-2006.pdf.
Have a good weekend everyone!
Dave
Richard Kraszewski <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
02/22/2008 01:48 PM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Richard Kraszewski <[log in to unmask]>
To
[log in to unmask]
cc
Subject
Re: [TN] Shrink hole voids
At the April 2007 IPC Reliability Conference in Boston, Solectron had a
presentation that addressed this. There, they presented a case that
deminished the concern for these shrink voids. I also believe that they
were to present it to the IPC for consideration of revising the IPC 610
handbook. I'm not to sure if that was accepted by the IPC committee
that handles that or if it is still under consideration. Does anyone
know?
I suggest you review the data presented in that report. (Not sure if
that is the report that you were refering to at the start of this or
not.)
Rich Kraszewski / Kimball-GTS
847-621-7310
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
Sent: Friday, February 22, 2008 2:23 PM
To: [log in to unmask]
Subject: Re: [TN] Shrink hole voids
David,
Please see IPC-610D, section 5.2.11 Soldering Anomalies - Hot
Tear/Shrink Holes
Assuming you are talking about lead free soldering, the standard says it
is OK unless you can see the bottom or it contacts the lead or land.
I know Celestica has published at least one paper where they looked at
the effect of shrinkage voids on lead free BGA balls and state it is not
an issue. However, I have also heard Craig Hillman of DfR say they can
be.
Bev
RIM
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David Tremmel
Sent: Friday, February 22, 2008 1:29 PM
To: [log in to unmask]
Subject: [TN] Shrink hole voids
Hello TechNet Gurus,
I read an article that say that a shrink hole void (hot tear or sink
hole)
is not a crack, does not impact reliability, does not continue to grow
under
thermo-mechanical stresses.
This seems to go against my common sense and would venture to say adds
to
solder creep fatigue.
Would anyone like to comment on my comment and/or offer a link to where
I
can find more information?
I am a poor country and your two cents goes a loooooong way.
As always, thank you in advance.
Thank you,
David Tremmel
Value Recovery
847 858-5540 - Cell
847 557-9574 - Office
847 557-9573 - Fax
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