David,
Please see IPC-610D, section 5.2.11 Soldering Anomalies - Hot
Tear/Shrink Holes
Assuming you are talking about lead free soldering, the standard says it
is OK unless you can see the bottom or it contacts the lead or land.
I know Celestica has published at least one paper where they looked at
the effect of shrinkage voids on lead free BGA balls and state it is not
an issue. However, I have also heard Craig Hillman of DfR say they can
be.
Bev
RIM
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David Tremmel
Sent: Friday, February 22, 2008 1:29 PM
To: [log in to unmask]
Subject: [TN] Shrink hole voids
Hello TechNet Gurus,
I read an article that say that a shrink hole void (hot tear or sink
hole)
is not a crack, does not impact reliability, does not continue to grow
under
thermo-mechanical stresses.
This seems to go against my common sense and would venture to say adds
to
solder creep fatigue.
Would anyone like to comment on my comment and/or offer a link to where
I
can find more information?
I am a poor country and your two cents goes a loooooong way.
As always, thank you in advance.
Thank you,
David Tremmel
Value Recovery
847 858-5540 - Cell
847 557-9574 - Office
847 557-9573 - Fax
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