Following my previous response to Jack regarding Werner's PCB paper, I
started doing a little reading, and was hoping someone could further explain
the phenomenon of "torque loads on the inner layer connections due to land
rotation".  How is this caused?  I feel I fully understand the radial stress
on the vias from resin expansion, but how is rotation incurred?  Also, is
there specific testing to determine if a PTV barrel interconnect is weak
within the PCB itself, explaining any resulting ILS from soldering process?

 

Thanks,

 

Kevin Glidden

Manufacturing Engineer

Luminescent Systems Inc.


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