I agree. The nickel takes a little more time at a higher temp when using
305 to form a good IM bond. Judging from the pictures, that may not be
happening. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /*
Sent: Friday, February 15, 2008 8:49 PM
To: [log in to unmask]
Subject: Re: [TN] Samsung Memory BGA Failure

Hi Phil,
How do you KNOW that "the BGA balls see 237-245 for 30 seconds minimum."
The BGA balls run significantly lower in t than anything else on your
assembly. 
Given the combination of SAC+ENIG you need to run the peak reflow zone
to at least 260C.
My opinion-you just have not made any solder joints.

Werner



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