Hello TechNet Gurus,

 

 

If there any of you out there that have to do BGA or large QFP rework on
Class 2 assemblies at lead free temperatures, what general rule do you
follow to bake the moisture out of the board?

 

Even if the component has an MSL of 2a, 2 or 1, that does not mean that the
PCB does not have an equivalent MSL so to speak.  I generally shoot for 8
hours at 105°C but sometimes in a pinch will shorten it to 4 hours at 105°C
for a standard 1.0 mm (or so) PCB.

 

I am sure that 'it depends' will come up but I was wondering if I should
consider the board itself as a 'BGA' with an MSL of 2a or 2.

 

 

If anyone would like to share their experience, I thank you in advance.

 

 

Thank you,

 

David Tremmel

847 858-5540 - Cell

847 557-9574 - Office

847 557-9573 - Fax

 


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