Hi Phil,
Your T-measurement method is perfect—you IN FACT know what the T's are.
My recommendation for reflow soldering is:
Liquidus + 20C + (15 to 20C when soldering to NI) for 5 seconds minimum; thus
in your case we have 217 + 20 + 15 = 252C for 5 seconds
So, it is still likely you have not formed a decent metallurgical bond.
Werner
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