Hi Werner,

I drilled a hole in the board from below and mounted my thermocouple in 
dead center of the solder joint for the center balls.

Samsung's recommended profile is measured by attaching the thermocouple on 
the top of the package, but I prefer my method for accuracy reasons.

The oven zone is not 237-245C.

Phil

At 09:48 PM 2/15/2008 -0500, Werner Engelmaier /* wrote:
>Hi Phil,
>How do you KNOW that "the BGA balls see 237-245 for 30 seconds minimum." The
>BGA balls run significantly lower in t than anything else on your assembly.
>Given the combination of SAC+ENIG you need to run the peak reflow zone to at
>least 260C.
>My opinion—you just have not made any solder joints.
>
>Werner
>
>
>
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