Hi Phil,
While Dave is theoretically correct, there is hardly a chance for too much
Ni/Sn IMCs in a product assembly process because of the exceedingly slow
dissolution rate of Ni in Sn [look at Klein-Wassink's book or my June/July 2005
column in GSMT&P magazine].
I your case you have essentially no IMCs as far as I can tell and thus do not
have solder joints. you also do not have solder joint fractures, just a
separation of some surfaces that had a weak mechanical adhesion.
Werner
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