Is this a DIMM card?
Is the failure associated with a date code or random?
Is the DIMM card fails on other product lines?
Is this failure on a production?
Bending of DIIM card during insertion is possible.
Victor,
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Igoshev, Vladimir
Sent: Friday, February 15, 2008 3:06 PM
To: [log in to unmask]
Subject: Re: [TN] Samsung Memory BGA Failure
Hi Phil,
It looks like you are dealing with a "Brittle Fracture" (NOT BP!!!).
You'd need to know whether the boards were accidentally dropped (bent)
and I'd take a look at the shape of the intermetallics at the board side
(etch off the solder to see the crystals), as it could tell me more
about the root cause.
Regards,
Vladimir
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Phillip Bavaro
Sent: Friday, February 15, 2008 3:57 PM
To: [log in to unmask]
Subject: Re: [TN] Samsung Memory BGA Failure
Hi Bob,
Yes, it is definitely at the interface, right where the IMC is.
The pads are ENIG and have been cleared of any contaminants by EDAX.
The cracks completely shear the component off the board in one assembly
which had a bit of stress due to mask defined apertures which were
accidently reduced.
On another assembly the cracks only penetrate three balls in from the
outside (currently....).
Phil
At 03:28 AM 2/13/2008 -0800, bob wettermann wrote:
>Dear Phil:
>
>1. Have you done a dye and pry and confirmed that is indead the
ball/board
>interface?
>
>
>2. Have you completed an analysis of the pad to determine what if any
>constitutes are o the pads?
>
>3. Are the cracks or opens across all areas of the BGA or just corners
or
>one area?
>
>Bob Wettermann
>BEST
>Phillip Bavaro <[log in to unmask]> wrote: I am wondering if
>anyone else out there has run into a problem with a
>Samsung Flash memory device (in this case, the 0.8 mm pitch, 107 pin
sac305
>BGA) where the connections are cracking right at the interface between
the
>pwb and ball.
>
>I had read about some Samsung BGA problems but cannot find the link to
the
>information now.
>
>We have other BGA's on the same board without any issues. Shear
strength
>test results are very low as well (if the flash has not already popped
off
>by itself).
>
>I'll try to get some pictures to Steve to put up tonight. My current
>thoughts are CTE's are grossly mis-matched as we haven't found anything
on
>the pads to account for the gross failure.
>
>Thanks in advance,
>
>Phil
>
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