Thanks Steve.

Yes, it is typical of the fractures.  At 08:58 AM 2/15/2008 -0600, Steve 
Gregory wrote:
>Hi Phil!
>
>Got the picture you sent yesterday afternoon posted now, it's at:
>
>http://stevezeva.homestead.com/files/LP_BGA_Crack.jpg
>
>Man, fractured clean through! Do all the fractures look like that?
>
>Steve
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Phillip Bavaro
>Sent: Tuesday, February 12, 2008 7:59 PM
>To: [log in to unmask]
>Subject: [TN] Samsung Memory BGA Failure
>
>I am wondering if anyone else out there has run into a problem with a
>Samsung Flash memory device (in this case, the 0.8 mm pitch, 107 pin
>sac305
>BGA) where the connections are cracking right at the interface between
>the pwb and ball.
>
>I had read about some Samsung BGA problems but cannot find the link to
>the information now.
>
>We have other BGA's on the same board without any issues.  Shear
>strength test results are very low as well (if the flash has not already
>popped off by itself).
>
>I'll try to get some pictures to Steve to put up tonight.  My current
>thoughts are CTE's are grossly mis-matched as we haven't found anything
>on the pads to account for the gross failure.
>
>Thanks in advance,
>
>Phil
>
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