100%

Flat, sheared completely.

At 07:07 AM 2/13/2008 -0600, Victor Hernandez wrote:
>What % of the interface is fractured?
>
>Victor,
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of bob wettermann
>Sent: Wednesday, February 13, 2008 5:29 AM
>To: [log in to unmask]
>Subject: Re: [TN] Samsung Memory BGA Failure
>
>Dear Phil:
>
>1. Have you done a dye and pry and confirmed that is indead the
>ball/board interface?
>
>
>2. Have you completed an analysis of the pad to determine what if any
>constitutes are o the pads?
>
>3. Are the cracks or opens across all areas of the BGA or just corners
>or one area?
>
>Bob Wettermann
>BEST
>Phillip Bavaro <[log in to unmask]> wrote: I am wondering if
>anyone else out there has run into a problem with a
>Samsung Flash memory device (in this case, the 0.8 mm pitch, 107 pin
>sac305
>BGA) where the connections are cracking right at the interface between
>the
>pwb and ball.
>
>I had read about some Samsung BGA problems but cannot find the link to
>the
>information now.
>
>We have other BGA's on the same board without any issues.  Shear
>strength
>test results are very low as well (if the flash has not already popped
>off
>by itself).
>
>I'll try to get some pictures to Steve to put up tonight.  My current
>thoughts are CTE's are grossly mis-matched as we haven't found anything
>on
>the pads to account for the gross failure.
>
>Thanks in advance,
>
>Phil
>
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>Bob Wettermann
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