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February 2008

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Subject:
From:
Steve Gregory <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Steve Gregory <[log in to unmask]>
Date:
Fri, 15 Feb 2008 08:58:04 -0600
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text/plain
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Hi Phil!

Got the picture you sent yesterday afternoon posted now, it's at:

http://stevezeva.homestead.com/files/LP_BGA_Crack.jpg

Man, fractured clean through! Do all the fractures look like that?

Steve

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Phillip Bavaro
Sent: Tuesday, February 12, 2008 7:59 PM
To: [log in to unmask]
Subject: [TN] Samsung Memory BGA Failure

I am wondering if anyone else out there has run into a problem with a
Samsung Flash memory device (in this case, the 0.8 mm pitch, 107 pin
sac305
BGA) where the connections are cracking right at the interface between
the pwb and ball.

I had read about some Samsung BGA problems but cannot find the link to
the information now.

We have other BGA's on the same board without any issues.  Shear
strength test results are very low as well (if the flash has not already
popped off by itself).

I'll try to get some pictures to Steve to put up tonight.  My current
thoughts are CTE's are grossly mis-matched as we haven't found anything
on the pads to account for the gross failure.

Thanks in advance,

Phil

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