TECHNET Archives

February 2008

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Hfjord <[log in to unmask]>
Date:
Thu, 14 Feb 2008 18:56:24 +0100
Content-Type:
text/plain
Parts/Attachments:
text/plain (120 lines)
Guru Richard,
I don't quite understand your philosophy. We don't pay much attention to the
fillet heel HEIGHT, but rather the wetting quality. A  'high' fillet has
sometimes proven to be false, with nearly no true adhesion to the component
(in this case we had issues with ceramic caps). Furthermore, high fillets
are negative when soldering chip components on RF Teflon boards with metal
back, i.e. the CTE mismatch can cause component cracks. We have produced
hundreds of thousands boards with the requirement, that the fillets should
be as 'low' as possible, the reliability and joint strength based on good
adhesion between the component's projection on the board, rather than fat
fillets. If the physical conditions of the two parts, board pad and
component termination, are good, the capillary force will provide for a
suitable and nice fillet, very often only some 25 percent of the total
height.  I have a whole book based on wetting mechanisms, and the authors
underline what I said above. There is no math for deciding fillet heel
height in the book. If all I say here is wrong, my soldering universe will
disappear under my feet, and I'll fall free in the cyber solder pot.

Inge

-----Ursprungligt meddelande-----
Från: TechNet [mailto:[log in to unmask]] För Stadem, Richard D.
Skickat: den 14 februari 2008 14:26
Till: [log in to unmask]
Ämne: Re: [TN] Minimum Heel Fillet Height

Herminia,
Because the heel fillet is the only portion of the solder joint
(typically) that is made to the finished (flat) portion of the component
lead, it is the most critical. The toe and side fillets are formed to
exposed copper. While it is desirable to have good toe and heel fillets,
the heel is the most important.
With that in mind, a decision was made to require a heel fillet at least
half a lead thickness in height.
Having sufficient amounts of solder paste certainly improves one's
chances of obtaining a Class 3 fillet, but certainly does not gaurantee
it.
Just because you have proof that your solder thickness sufficient to
form a good solder fillet isn't good enough. Solder does not always wet
where it is supposed to, or this forum would never have existed.
JEDEC standards exist for coplanarity of component leads.  

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Herminia Guevarra
Sent: Wednesday, February 13, 2008 5:01 PM
To: [log in to unmask]
Subject: [TN] Minimum Heel Fillet Height

Hi, folks,

 

Can anybody please explain in details how the minimum heel fillet height
criteria for Class 2 was computed and specified?

 

F= solder thickness (G) + 50% lead thickness

 

Can solder thickness be solder paste height prior reflow?

 

What about if leads are not coplanar?  What would be the spec for co
planarity?  How can they be measured?

 

Need reply...

 

Thanks,

 

Herminia 

 


---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0 To
unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or
(re-start) delivery of Technet send e-mail to [log in to unmask]: SET
Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the
posts: send e-mail to [log in to unmask]: SET Technet Digest Search the
archives of previous posts at: http://listserv.ipc.org/archives Please
visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for
additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2