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February 2008

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Subject:
From:
Ryan Grant <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Mon, 4 Feb 2008 17:55:06 -0700
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text/plain
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text/plain (29 lines)
Hi All,

I just got told by a design engineer that LaserJet printers are built
using via in pad where the via is NOT plugged.  He claims the via is
filled with solder first, then goes through the normal SMT process.  

He intends to use this to connect a BGA ball on one side of the board to
a cap on the other side using an mechanically drill via that is not
plugged.

Before I call BS on this, and tell him "do not pass go until that via is
plugged, flattened and plated over", has anyone been successful with a
via in pad that is not plugged?  
If so, was it double sided?  
And, was one side connected to a BGA ball?

Thanks,
Ryan

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