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February 2008

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Subject:
From:
Guy Ramsey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Guy Ramsey <[log in to unmask]>
Date:
Thu, 14 Feb 2008 08:29:49 -0500
Content-Type:
text/plain
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text/plain (76 lines)
Essentially, it says the solder fillet needs to be 50% of the thickness of
the heel bend or lead thickness (depending on the package). The "G"
thickness is there to prevent someone from saying, "It would have been 50%
of the lead thickness, if the lead were coplanar". 


None of these are intended to be measured. They are visual criteria. In my
opinion, if companies out there using measuring tools trying prove
acceptance are miss using the standard. 


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Herminia Guevarra
Sent: Wednesday, February 13, 2008 6:01 PM
To: [log in to unmask]
Subject: [TN] Minimum Heel Fillet Height

Hi, folks,

 

Can anybody please explain in details how the minimum heel fillet height
criteria for Class 2 was computed and specified?

 

F= solder thickness (G) + 50% lead thickness

 

Can solder thickness be solder paste height prior reflow?

 

What about if leads are not coplanar?  What would be the spec for co
planarity?  How can they be measured?

 

Need reply...

 

Thanks,

 

Herminia 

 


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