I would like to see BGA solder bump fractures too.
Victor,
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /*
Sent: Tuesday, February 12, 2008 3:26 PM
To: [log in to unmask]
Subject: Re: [TN] Through Hole Pad Solder Non-Wetting
Hi Paymon,
Could you send me those pics too?
Werner
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