Victor,
I was not stating that it was the actual problem but that it could be. The
image you attached is a cross-section that did not fail. In some cases the
gold removal process succeeds on most of the board hence only a few regions
will exhibit the problem.
The resulting failure is not easy to see. If you seem to see intermetallic with a
layer of nickel attached seperating from the PCB that still has a nickel layer
that is an indication. I'm not sure that the failed image clearly had that but it
was stated as different than the others.
The gold is almost invisible even at 800X magnification.
Without the sample on a microscope to view it is very hard to make a
determination. SEM analysis is even better to make determinations.
What I said I did not regard as an absolute fact in this case. It is just a
possiblity.
Drew
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