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Date: | Tue, 12 Feb 2008 16:21:29 -0500 |
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Hi Paymon,
Since I saw the images, I want to say that the solderability problem you
have most probably has nothing to do with the cavitaion in Cu in the
boards,
Regards,
Vladimir
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Paymon Sani
Sent: Tuesday, February 12, 2008 2:30 PM
To: [log in to unmask]
Subject: [TN] Through Hole Pad Solder Non-Wetting
Hello All,
We experienced solder non-wetting to a PCB through-hole component pad
surface. The PCB surface finish is ENIG. The microsection results from
the suspect PCBs show that the Nickel plating is thin from 1 to 3
micro-inches. We related the thin Nickel plating to Nickel corrosion and
PCB surface non-wetting. However, the microsection also revealed copper
corrosion at Copper to Nickel interface! I have never seen the copper
corrosion in the past and I would like to ask if any of you has a
similar experience in the past. What could be the cause of copper
corrosion? I have few images if you are interested to see them.
Regards,
Paymon
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