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Date: | Fri, 29 Feb 2008 10:54:44 -0500 |
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Best to define acceptable limits for kerfuffle for Class I/II/III
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Douglas O. Pauls
Sent: Friday, February 29, 2008 10:38 AM
To: [log in to unmask]
Subject: Re: [TN] Gold Plating Question
Kerfuffle? I like it.
Dewey, lets add that to the IPC T-50 document.
Doug Pauls
Craig Cullum <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
02/29/2008 09:35 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Craig Cullum <[log in to unmask]>
To
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cc
Subject
Re: [TN] Gold Plating Question
I just wanted to let everyone who participated in this thread that I
very
much appreciated learning something new. We recently experienced this
for
the first time (that I ever recall) and it caused a small kerfuffle and
some embarrassement on my part.
Thank you (from one lurker) !
Craig Cullum, Engineering Technologist, AMTELCO
e: [log in to unmask]
[log in to unmask]
f: 608 838 8367
v: 608 838 4194, or 4197, x128
Please visit us at www.amtelco.com
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Paul Greene
> Sent: Wednesday, February 27, 2008 3:07 PM
> To: [log in to unmask]
> Subject: Re: [TN] Gold Plating Question
>
<SNIP>
> Depending on the chamfer, the design itself may result in a
> piece of the buss bars being left. In either case, exposed
> copper will be seen and is acceptable per IPC-A-600.
> Paul Greene
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