Hi Phil,
What a high P-concentration does is create a weakly adhering Ni/P layer
between the ENi and the Ni3Sn4 IMC layers—the higher the P-concentration the weaker
the adhesion.
The P-concentration can be high because of the Ni plating process, but can
also be driven higher by more Ni dissolving in Sn due to long or multiple
soldering temperature exposures.
Werner
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