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Date: | Fri, 22 Feb 2008 12:28:32 -0600 |
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Hello TechNet Gurus,
I read an article that say that a shrink hole void (hot tear or sink hole)
is not a crack, does not impact reliability, does not continue to grow under
thermo-mechanical stresses.
This seems to go against my common sense and would venture to say adds to
solder creep fatigue.
Would anyone like to comment on my comment and/or offer a link to where I
can find more information?
I am a poor country and your two cents goes a loooooong way.
As always, thank you in advance.
Thank you,
David Tremmel
Value Recovery
847 858-5540 - Cell
847 557-9574 - Office
847 557-9573 - Fax
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