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February 2008

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TechNet <[log in to unmask]>
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Date:
Thu, 7 Feb 2008 17:46:48 -0500
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TechNet E-Mail Forum <[log in to unmask]>, "Igoshev, Vladimir" <[log in to unmask]>
Subject:
Re: SAC on gold pins
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"Igoshev, Vladimir" <[log in to unmask]>
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I wish I could :-)



Vladimir



----- Original Message -----

From: [log in to unmask] <[log in to unmask]>

To: Igoshev, Vladimir; [log in to unmask] <[log in to unmask]>

Sent: Thu Feb 07 17:32:47 2008

Subject: Re: [TN] SAC on gold pins



Hi Vladimir,

It is not 'just' my verbal references—come to my workshop on Solder Joint Reliability: Part 2 [see outline on my website] and I will show you the data from the IEEE Compliant Lead Task Force, and nice pics from Dimitri Grabbe, AMP, Reza Ghafferian, JPL, and H. Walter, AMIC GmbH.



Regards,

Werner Engelmaier

Engelmaier Associates, L.C.

Electronic Packaging, Interconnection and Reliability Consulting

7 Jasmine Run

Ormond Beach, FL 32174 USA

Phone: 386-437-8747, Cell: 386-316-5904

E-mail: [log in to unmask], Website: www.engelmaier.com







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