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January 2008

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Subject:
From:
Kevin Glidden <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Kevin Glidden <[log in to unmask]>
Date:
Wed, 2 Jan 2008 14:31:09 -0500
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text/plain (66 lines)
What is the stack-up?  How thick is the Al and FR4?  Is it single or double
sided?  How large is the PCB?

We routinely convection reflow solder small (1"x3.5") single-sided Berquist
T-clad PCBs with no issues.  But, we are not using LF.

http://www.bergquistcompany.com/ts_thermal_clad.cfm

I believe the metal substrate would only assist in temperature stabilization
in the soak zone.  For a larger PCB or thicker metal substrate, the devil is
in the profiling, particularly in ramping and cooling.

Interesting that Werner states vapor phase is the only way.  How would this
differ from a metal core PCB?  Are there not yet any RoHS compliant metal
core PCBs?

Kevin Glidden
Manufacturing Engineer
Luminescent Systems Inc.



-----Original Message-----
From: P. Langeveld [mailto:[log in to unmask]] 
Sent: Wednesday, January 02, 2008 10:58 AM
To: [log in to unmask]
Subject: [TN] reflow soldering metal backed pcb

Happy New Year and good health for all !!

Is there any who has experience with reflow soldering metal backed pcb's?
The metal is aluminium, the insulation is FR4, the solder is lead free.

I am looking for a process window.

Regards,

Peer Langeveld
Consultant Soft Soldering
5502 VH8
The Netherlands

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