There is still time to register for IPC's upcoming workshops on January
16, 2008. These workshops are being offered in the beautiful city of San
Jose, CA and are hosted by Tessera, Inc.!
PD-01: Fundamentals of Printed Circuit Technology - Materials and
Manufacturing Processes
January 16, 2008 - San Jose, CA
Hosted by Tessera, Inc.
8:30 am - 11:30 am
Instructor: Joseph Fjelstad, Silicon Pipe, Inc.
This half-day course provides a comprehensive overview of this
indispensable technology. It reviews the materials and processes that
comprise the wide array of electronic interconnection substrates used
today and why they were chosen. You will learn about multilayer, metal
core, embossed, flexible and rigid flex circuits and more.
PD-02: Design Principles for BGA and CSP Technology Implementation
January 16, 2008 - San Jose, CA
Hosted by Tessera, Inc.
1:00 pm - 4:00 pm
Instructor: Vern Solberg, Tessera Technologies, Inc.
This workshop is based on the latest version of the IPC-7095 document,
Design and Assembly Process Implementation for BGAs, and covers both
wide and fine-pitch BGA packaging methodology. The information will
focus on IC packaging standards, review qualification requirements and
study land pattern geometry alternatives, circuit routing guidelines as
well as important factors related to high density PCB fabrication
technologies, assembly process development, inspection criteria and
solder quality assessment.
This is your chance to gain valuable knowledge on these hot topics! For
more information or to register, please cut and paste
www.ipc.org/Tess0108 into your browser and download the registration
form. Hurry and register today!
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