TECHNET Archives

January 2008

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Brian Ellis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Brian Ellis <[log in to unmask]>
Date:
Thu, 10 Jan 2008 09:45:04 +0200
Content-Type:
text/plain
Parts/Attachments:
text/plain (151 lines)
I would be quite worried at what I see here. To me, it looks like 
vesication. This is caused by the solder mask being placed over a 
hygroscopic contaminant. As the mask is semi-porous (as are all 
polymers), the contaminant absorbs moisture and forms the bubble where 
adhesion is poor. Note that there is a halo round each defect; this 
could be because the pressure in the bubble rises and tends to pull the 
mask off.

You can confirm this possible diagnosis by autoclaving a board in steam, 
using a domestic pressure cooker for 24 h or so (making sure that it 
never boils dry). If the problem appears worse, then it is confirmed.

Brian (not brain: I lost that many years ago!)

Luan Nguyen wrote:
> Sorry! I send you file attached but maybe you will not receive it. You
> can see the picture on
> http://picasaweb.google.com/johnynhluan/BubbleDefectOnPCB 
> 
> Best regards,
> 
> 
>>>> [log in to unmask] 10-Jan-08 08:32:31 >>>
> Thank you Brain!
> I have some pictures of this defect to refer.
> Please give me a advice for this defect.
> 
> Thanks and best regards,
> 
> 
>>>> [log in to unmask] 09-Jan-08 13:37:58 >>>
> If there is one >0.25 mm, then the board should be rejected.
> If there are 3 or more of <0.25 mm the board should be rejected.
> 
> Furthermore, and this is my opinion, if a bubble <0.25 mm is between
> two 
> tracks and occupies >50% of the spacing between the tracks, it should 
> also be rejected.
> 
> Brian
> 
> Luan Nguyen wrote:
>> Dear Technet,
>> Our company were been happening a problem on PCB, details:
>> Per IPC-A-600, Revision G
>> 2.9 SOLDER RESIST (Solder Mask)
>> 2.9.4 Blisters/ Delamination
>> - Acceptable - class 2,3:
>> . Two per side not exceeding 0.25 mm [0.00984 in] in the greatest
>> dimension.
>>
>> According to our understanding:
>> - If there are 3 bubbles and each of them is exceeding 0.25 mm in
> the
>> greatest dimension per side, this is defect.
>> - In case, if there are more than 3 bubbles and each of them is not
>> exceeding 0.25 mm in the greatest dimension per side, this is defect
> or
>> accept ???
>> Please help us understand clearly it.
>>
>> Thanks and best regards,
>>
>>
>> ***************************
>> Nguyen Hoang Luan
>> QC&Training Supervisor
>> Spartronics VietNam Co, Ltd.
>> No.3, Street No.6, VSIP
>> Th An Dist., BDuong Prov., VN
>> Tel: (84-650) 784 890
>> Fax: (84-650) 784 891
>> Mobile: 090.3.667448
>> Email: [log in to unmask] 
>> ***************************
>>
>> ---------------------------------------------------
>> Technet Mail List provided as a service by IPC using LISTSERV 15.0
>> To unsubscribe, send a message to [log in to unmask] with following
> text in
>> the BODY (NOT the subject field): SIGNOFF Technet
>> To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
>> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
>> Search the archives of previous posts at:
> http://listserv.ipc.org/archives 
>> Please visit IPC web site
> http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
> information, or contact Keach Sasamori at [log in to unmask] or
> 847-615-7100
> ext.2815
>> -----------------------------------------------------
>>
> 
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 15.0
> To unsubscribe, send a message to [log in to unmask] with following text
> in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at:
> http://listserv.ipc.org/archives 
> Please visit IPC web site
> http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
> information, or contact Keach Sasamori at [log in to unmask] or
> 847-615-7100
> ext.2815
> -----------------------------------------------------
> 
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 15.0
> To unsubscribe, send a message to [log in to unmask] with following text
> in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at:
> http://listserv.ipc.org/archives 
> Please visit IPC web site
> http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
> ext.2815
> -----------------------------------------------------
> 
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 15.0
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
> -----------------------------------------------------
> 

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2