Hi Nguyen,
 
Base on our spec. and experience, my propose as below:
1. Allow soldermask void less than or equal to 2mil by longest dimensions at anywhere of the PCB. 
2. Soldermask void greater than 2mil and less than 10mil in longest dimension is allowed if there were solder resist between the conductor and any other adjacent conductor.
 
From your pictures, I suppose most of the voids are less than 2mil and there are still soldermask between conductors, so, I think there are acceptable with a quite low risk.
 
 
Best regards,
 
 
Gause> Date: Thu, 10 Jan 2008 09:49:56 +0700> From: [log in to unmask]> Subject: [TN] Fwd: Re: [TN] Air bubble in solder resist> To: [log in to unmask]> > Sorry! I send you file attached but maybe you will not receive it. You> can see the picture on> http://picasaweb.google.com/johnynhluan/BubbleDefectOnPCB > > Best regards,> > > >>> [log in to unmask] 10-Jan-08 08:32:31 >>>> Thank you Brain!> I have some pictures of this defect to refer.> Please give me a advice for this defect.> > Thanks and best regards,> > > >>> [log in to unmask] 09-Jan-08 13:37:58 >>>> If there is one >0.25 mm, then the board should be rejected.> If there are 3 or more of <0.25 mm the board should be rejected.> > Furthermore, and this is my opinion, if a bubble <0.25 mm is between> two > tracks and occupies >50% of the spacing between the tracks, it should > also be rejected.> > Brian> > Luan Nguyen wrote:> > Dear Technet,> > Our company were been happening a problem on PCB, details:> > !
Per IPC-A-600, Revision G> > 2.9 SOLDER RESIST (Solder Mask)> > 2.9.4 Blisters/ Delamination> > - Acceptable - class 2,3:> > . Two per side not exceeding 0.25 mm [0.00984 in] in the greatest> > dimension.> > > > According to our understanding:> > - If there are 3 bubbles and each of them is exceeding 0.25 mm in> the> > greatest dimension per side, this is defect.> > - In case, if there are more than 3 bubbles and each of them is not> > exceeding 0.25 mm in the greatest dimension per side, this is defect> or> > accept ???> > Please help us understand clearly it.> > > > Thanks and best regards,> > > > > > ***************************> > Nguyen Hoang Luan> > QC&Training Supervisor> > Spartronics VietNam Co, Ltd.> > No.3, Street No.6, VSIP> > Th An Dist., BDuong Prov., VN> > Tel: (84-650) 784 890> > Fax: (84-650) 784 891> > Mobile: 090.3.667448> > Email: [log in to unmask] > > ***************************> > > > ---------------------------------------------------> > Technet !
Mail List provided as a service by IPC using LISTSERV 15.0> > To unsubscribe, send a message to [log in to unmask] with following> text in> > the BODY (NOT the subject field): SIGNOFF Technet> > To temporarily halt or (re-start) delivery of Technet send e-mail to> [log in to unmask]: SET Technet NOMAIL or (MAIL)> > To receive ONE mailing per day of all the posts: send e-mail to> [log in to unmask]: SET Technet Digest> > Search the archives of previous posts at:> http://listserv.ipc.org/archives > > Please visit IPC web site> http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional> information, or contact Keach Sasamori at [log in to unmask] or> 847-615-7100> ext.2815> > -----------------------------------------------------> > > > ---------------------------------------------------> Technet Mail List provided as a service by IPC using LISTSERV 15.0> To unsubscribe, send a message to [log in to unmask] with following text> in> the BODY (NOT the subject field): SIGNOFF Technet> To !
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