Thank you Brain!
I have some pictures of this defect to refer.
Please give me a advice for this defect.
Thanks and best regards,
>>> [log in to unmask] 09-Jan-08 13:37:58 >>>
If there is one >0.25 mm, then the board should be rejected.
If there are 3 or more of <0.25 mm the board should be rejected.
Furthermore, and this is my opinion, if a bubble <0.25 mm is between
two
tracks and occupies >50% of the spacing between the tracks, it should
also be rejected.
Brian
Luan Nguyen wrote:
> Dear Technet,
> Our company were been happening a problem on PCB, details:
> Per IPC-A-600, Revision G
> 2.9 SOLDER RESIST (Solder Mask)
> 2.9.4 Blisters/ Delamination
> - Acceptable - class 2,3:
> . Two per side not exceeding 0.25 mm [0.00984 in] in the greatest
> dimension.
>
> According to our understanding:
> - If there are 3 bubbles and each of them is exceeding 0.25 mm in
the
> greatest dimension per side, this is defect.
> - In case, if there are more than 3 bubbles and each of them is not
> exceeding 0.25 mm in the greatest dimension per side, this is defect
or
> accept ???
> Please help us understand clearly it.
>
> Thanks and best regards,
>
>
> ***************************
> Nguyen Hoang Luan
> QC&Training Supervisor
> Spartronics VietNam Co, Ltd.
> No.3, Street No.6, VSIP
> Th An Dist., BDuong Prov., VN
> Tel: (84-650) 784 890
> Fax: (84-650) 784 891
> Mobile: 090.3.667448
> Email: [log in to unmask]
> ***************************
>
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