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January 2008

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Subject:
From:
Werner Engelmaier /* <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 9 Jan 2008 13:22:25 EST
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In a message dated 1/9/08 11:07:57, [log in to unmask] writes:

> It seems like most CMs
> however, are focused on the TAL using 183 C as a starting point, which
> the SnPb paste manufacturer's recommend.
> 
Hi Joe,
Unfortunately [or fortunately for my business], indeed. The TAL may be 
important for the flux in the paste, but is totally irrelevant for the solder joint 
quality.


Werner



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