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January 2008

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Subject:
From:
Luan Nguyen <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Luan Nguyen <[log in to unmask]>
Date:
Wed, 9 Jan 2008 09:24:02 +0700
Content-Type:
text/plain
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text/plain (42 lines)
Dear Technet,
Our company were been happening a problem on PCB, details:
Per IPC-A-600, Revision G
2.9 SOLDER RESIST (Solder Mask)
2.9.4 Blisters/ Delamination
- Acceptable - class 2,3:
. Two per side not exceeding 0.25 mm [0.00984 in] in the greatest
dimension.

According to our understanding:
- If there are 3 bubbles and each of them is exceeding 0.25 mm in the
greatest dimension per side, this is defect.
- In case, if there are more than 3 bubbles and each of them is not
exceeding 0.25 mm in the greatest dimension per side, this is defect or
accept ???
Please help us understand clearly it.

Thanks and best regards,


***************************
Nguyen Hoang Luan
QC&Training Supervisor
Spartronics VietNam Co, Ltd.
No.3, Street No.6, VSIP
Th An Dist., BDuong Prov., VN
Tel: (84-650) 784 890
Fax: (84-650) 784 891
Mobile: 090.3.667448
Email: [log in to unmask]
***************************

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