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January 2008

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Subject:
From:
George Milad <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Tue, 8 Jan 2008 19:08:30 EST
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Selective finishes are common and are used where OSP is chosen for the  
soldering pads and ENIG (electroless nickel immersion gold) is used for the  
contacting surface.
 
An alternative would be ENEPIG (electroless nickel, electroless palladium,  
immersion gold) across the board, NO OSP.
 
This finish does both soldering and contacting very sucessfully  particularly 
if you plan to use LF solder.   

Regards
George Milad
George Milad
National Accounts  Manager for Technology
Uyemura International Corp (UIC)
249 Town Line Rd  
Southington CT 06489
[log in to unmask]
Cell: (516) 901  3874




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