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January 2008

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TechNet E-Mail Forum <[log in to unmask]>, Hfjord <[log in to unmask]>
Date:
Tue, 8 Jan 2008 22:16:21 +0100
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If someone has a 'warpage' problem, there is a way to design boards that are
less apt to bending. NASA are working with new ideas, and Glenn Research
Center together with Applied Materials, are making the new hardware. This is
a carbon cloth, that is integrated with the FR4. The benefit is better
cooling, better electrical performance and much stiffer board, the later
means little or no warpage. I've seen these boards, but can't find the
source at the moment. I'm sure someone on TN have more to show us here.
If there are patent matters that hinder you for using the concept, I don't
know.

If I find more on this theme, I'll be back.


/Inge

-----Ursprungligt meddelande-----
Från: Hfjord [mailto:[log in to unmask]] 
Skickat: den 8 januari 2008 16:56
Till: 'TechNet E-Mail Forum'; [log in to unmask]
Ämne: SV: [TN] Warpage of components

I promised a simple warpage calculation formula, if not too many, I'll send
offline...
Inge

-----Ursprungligt meddelande-----
Från: TechNet [mailto:[log in to unmask]] För Werner Engelmaier /*
Skickat: den 8 januari 2008 14:15
Till: [log in to unmask]
Ämne: Re: [TN] Warpage of components

HI Ingemar,
Well said.
A warpage criterion for components would have to be based on a total 
out-of-plane measurement at soldering temperatures. This non-coplanarity
measure would 
have to be about the thickness of the solder paste layer to avoid solder 
opens, and it would have to be based on the total final solder joint
thickness to 
avoid solder joint cracking due to warpage tensile loads on cooling from 
reflow.

Werner



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